Yeguang Xue


  • Ph.D. student Mechanical Engineering, Northwestern University, Evanston, IL, USA.
  • B.Eng. Engineering Mechanics (Hons), Zhejiang University, Hangzhou, China.
Honors and Rewards

  • Ryan Fellowship by The International Institute for Nanotechnology (2016)
  • Walter P. Murphy Fellowship by Northwestern University (2014)
  • Xu Zhi-Lun Outstanding Students in Mechanics Honorable Mention (2014)
  • Third Price in Zhou Pei-Yuan Mechanics Competition (2013)
  • Meritorious Winner of Mathematical Contest in Modeling (MCM) by COMAP (2013)
  • First-Class Scholarship for Research and Innovation by Zhejiang University (2013)
  • First-Class Scholarship for Outstanding Students by Zhejiang University (2011, 2013)
  • First-Class Scholarship for Outstanding Merits by Zhejiang University (2011, 2012, 2013)
  • Scholarship for Aerospace Technology by China Space Foundation (2011, 2012, 2013)
  • National Scholarship by Ministry of Education of The People’s Republic of China (2011)

  • Reviewer: Journal of Applied Mechanics (Transactions of the ASME)
Selected Publications

  1. X. Wang, Y. Ma, Y. Xue, H. Luan, M. Pharr, X. Feng, J. A. Rogers and Y. Huang, "Collapse of liquid-overfilled strain-isolation substrates in wearable electronics", International Journal of Solids and Structures 117, 137-142 (2017)
  2. H. Fang, K. J. Yu, C. Gloschat, Z. Yang, E. Song, C. Chiang, J. Zhao, S. M. Won, S. Xu, M. Trumpis, Y. Zhong, S. W. Han, Y. Xue, D. Xu, S. W. Choi, G. Cauwenberghs, M. Kay, Y. Huang, J. Viventi, I. R. Efimov and J. A. Rogers, "Capacitively coupled arrays of multiplexed flexible silicon transistors for long-term cardiac electrophysiology", Nature Biomedical Engineering 1, 0038 (2017)
  3. Y. Y. Yu, X. J. Bai, M. C. Kung, Y. Xue, Y. Huang, D. T. Keane and H. H. Kung, "Electromechanical properties of reduced graphene oxide thin film on 3D elastomeric substrate", Carbon 115, 380-387 (2017)
  4. X. Ning, H. Wang, X. Yu, J. A. Soares, Z. Yan, K. Nan, G. Velarde, Y. Xue, R. Sun, Q. Dong, H. Luan, C. M. Lee, A. Chempakasseril, M. Han, Y. Wang, L. Li, Y. Huang, Y. Zhang and J. A. Rogers, "3D Tunable, Multiscale, and Multistable Vibrational Micro-Platforms Assembled by Compressive Buckling", Advanced Functional Materials 27, (2017)
  5. Y. K. Lee, K. Jang, Y. Ma, A. Koh, H. Chen, H. N. Jung, Y. Kim, J. W. Kwak, L. Wang, Y. Xue, Y. Yang, W. Tian, Y. Jiang, Y. Zhang, X. Feng, Y. Huang and J. A. Rogers, "Chemical Sensing Systems that Utilize Soft Electronics on Thin Elastomeric Substrates with Open Cellular Designs", Advanced Functional Materials 27, (2017)
  6. Y. Xue, D. Kang, Y. Ma, X. Feng, J. A. Rogers and Y. Huang, "Collapse of microfluidic channels/reservoirs in thin, soft epidermal devices", Extreme Mechanics Letters 11, 18-23 (2017)
  7. K. Nan, H. Luan, Z. Yan, X. Ning, Y. Wang, A. Wang, J. Wang, M. Han, M. Chang, K. Li, Y. Zhang, W. Huang, Y. Xue, Y. Huang, Y. Zhang and J. A. Rogers, "Engineered Elastomer Substrates for Guided Assembly of Complex 3D Mesostructures by Spatially Nonuniform Compressive Buckling", Advanced Functional Materials 27, (2017)
  8. Y. Ma, M. Pharr, L. Wang, J. Kim, Y. Liu, Y. Xue, R. Ning, X. Wang, H. U. Chung, X. Feng, J. A. Rogers and Y. Huang, "Soft Elastomers with Ionic Liquid-Filled Cavities as Strain Isolating Substrates for Wearable Electronics", Small 13, (2017)
  9. J. Choi, Y. Xue, W. Xia, T. Ray, J. Reeder, A. Bandodkar, D. Kang, S. Xu, Y. Huang and J. A. Rogers, "Soft, skin-mounted microfluidic systems for measuring secretory fluidic pressures generated at the surface of the skin by eccrine sweat glands", Lab Chip (2017)
  10. A. Koh, D. Kang, Y. Xue, S. Lee, R. M. Pielak, J. Kim, T. Hwang, S. Min, A. Banks, P. Bastien, M. C. Manco, L. Wang, K. R. Ammann, K. Jang, P. Won, S. Han, R. Ghaffari, U. Paik, M. J. Slepian, G. Balooch, Y. Huang and J. A. Rogers, "A soft, wearable microfluidic device for the capture, storage, and colorimetric sensing of sweat", Science Translational Medicine 8, (2016)
  11. Y. Ma, K. Jang, L. Wang, H. N. Jung, J. W. Kwak, Y. Xue, H. Chen, Y. Yang, D. Shi, X. Feng, J. A. Rogers and Y. Huang, "Design of Strain-Limiting Substrate Materials for Stretchable and Flexible Electronics", Advanced Functional Materials 26, 5345-5351 (2016)
  12. Y. Zhang, R. C. Webb, H. Luo, Y. Xue, J. Kurniawan, N. H. Cho, S. Krishnan, Y. Li, Y. Huang and J. A. Rogers, "Theoretical and Experimental Studies of Epidermal Heat Flux Sensors for Measurements of Core Body Temperature", Advanced Healthcare Materials 5, 119-127 (2016)
  13. H. Fang, J. Zhao, K. J. Yu, E. Song, A. B. Farimani, C. Chiang, X. Jin, Y. Xue, D. Xu, W. Du, K. J. Seo, Y. Zhong, Z. Yang, S. M. Won, G. Fang, S. W. Choi, S. Chaudhuri, Y. Huang, M. A. Alam, J. Viventi, N. R. Aluru and J. A. Rogers, "Ultrathin, transferred layers of thermally grown silicon dioxide as biofluid barriers for biointegrated flexible electronic systems", Proceedings of the National Academy of Sciences of the United States of America 113, 11682-11687 (2016)
  14. Y. Ma, Y. Xue, K. Jang, X. Feng, J. A. Rogers and Y. Huang, "Wrinkling of a stiff thin film bonded to a pre-strained, compliant substrate with finite thickness", Proceedings of the Royal Society a-Mathematical Physical and Engineering Sciences 472, (2016)
  15. Y. Xue, Y. Zhang, X. Feng, S. Kim, J. A. Rogers and Y. Huang, "A theoretical model of reversible adhesion in shape memory surface relief structures and its application in transfer printing", Journal of the Mechanics and Physics of Solids 77, 27-42 (2015)

  • 1st Midwest Mechanics of Materials and Structures workshop (Champaign, IL, Aug 26,2015), “Reversible Adhesion of Shape Memory Relief Structures and its Application in Transfer Printing”.
Research Experiences

  • Cross-disciplinary Scholars in Science and Technology (CSST) program, University of California, Los Angeles, USA. (Advisor: William S. Klug)
Teaching Experiences

  • Northwestern University MECH_ENG 495 Selected Topic: Advanced Fracture Mechanics (Grader)
  • Northwestern University MECH_ENG 495 Selected Topic: Mechanics of Thin Films (Grader)

  • Programming Languages: C/C++, Matlab/Octave, Python, Bash
  • Finite element software packages: ABAQUS, ANSYS, COMSOL
  • Molecular simulation: Lammps, Gromacs
  • CAD: AutoCAD, Solidworks
  • Front-end web development: jQuery, bootstrap