Curriculum Vitae


Education

  • Ph.D. Mechanical Engineering, Northwestern University, Evanston, IL, USA. (2014 - 2019)
  • B.Eng. Engineering Mechanics (Hons), Zhejiang University, Hangzhou, China. (2010 - 2014)

Experiences

  • IC Packaging Simulation Engineer, Apple Inc. (2019.12 - Now)
  • Software Engineer Intern, NeuroLux (2019.11 - 2019.12)
  • Display Investigation Engineer Intern, Apple Inc. (2019.3 - 2019.8)
  • Research Computing Services Assistant, Northwestern NUIT (2017.12 - 2019.2)
  • Visting Scholar, UCLA (2013.7 - 2013.9)

Honors and Rewards

  • Chinese Government Award for Outstanding Self-financed Students Abroad (2020)
  • Terminal Year Fellowship by Northwestern University (2018)
  • Ryan Fellowship by the International Institute for Nanotechnology (2016)
  • Walter P. Murphy Fellowship by Northwestern University (2014)
  • Xu Zhi-Lun Outstanding Students in Mechanics (2014)
  • Third Price in Zhou Pei-Yuan Mechanics Competition (2013)
  • Meritorious Winner of COMAP Mathematical Contest in Modeling (2013)
  • First-Class Scholarship for Research and Innovation by Zhejiang University (2013)
  • First-Class Scholarship for Outstanding Students by Zhejiang University (2011, 2013)
  • First-Class Scholarship for Outstanding Merits by Zhejiang University (2011, 2012, 2013)
  • Aerospace Technology Scholarship by China Space Foundation (2011, 2012, 2013)
  • National Scholarship by Ministry of Education of The People’s Republic of China (2011)

Services

  • Reviewer: Journal of Applied Mechanics (Transactions of the ASME), Journal of the Mechanics and Physics of Solids, Mechanics of Materials
  • Teaching Assistant/Grader at Northwestern University: Advanced Fracture Mechanics, Mechanics of Thin Films, Mechanics of Composite Materials, Fluid Mechanics
  • Workshop Lecturer at Northwestern Research Computing Services: Introduction to Vim, Introduction to Julia

Skills

  • Finite element software packages: ABAQUS, ANSYS APDL, COMSOL
  • Molecular dynamics simulation: Lammps, Gromacs
  • Programming Languages/Frameworks: C/C++, Python, Matlab/Octave, Julia, C#/.NET, Bash, SQL
  • Full-stack web development(FastAPI, Flask, Vue, Bootstrap)

Publications

Please see a full list of publications here.

Presentations

  • Reversible Adhesion of Shape Memory Relief Structures and its Application in Transfer Printing, 1st Midwest Mechanics of Materials and Structures workshop (Champaign, IL, 2015)
  • Mechanical Design of Soft, Wearable Microfluidic Devices, SES 2017 (Boston, MA, 2017)
  • Measuring Sweat Pressure, 3rd Midwest Mechanics of Materials and Structures workshop (West Lafayette, IN, 2017)
  • Mechanical Design of Soft, Wearable Microfluidic Devices, USNC/TAM 2018 (Chicago, IL, 2018)
  • Flow Control in Soft, Wearable Microfluidic Devices, SES 2018 (Madrid, Spain, 2018)

Last updated on 2024/01/20